
Optical MEMS sensing points
Passive sensing structures and application-specific packaging place the optical measurement close to the physical behaviour of interest.
Products and platform
CEKO combines optical MEMS sensing points, external interrogation and application integration in one configurable platform. Each system is adapted to the measurement location, operating environment and required data output.

Core platform
The same platform spans the sensing point, optical interrogation and the interfaces needed to turn measurements into usable information.

Passive sensing structures and application-specific packaging place the optical measurement close to the physical behaviour of interest.

External interrogation, control and data handling keep active electronics away from the measurement location and available for service and system integration.

Measurement data can be presented as trends, dashboards and interfaces for integration with application and asset-management systems.
Sensing modalities
The products shown here represent CEKO's current public focus areas. The same platform can support additional modalities through application-specific sensor design, packaging and integration.
Passive optical temperature measurement for electrically and environmentally demanding locations.
Optical MEMS sensing for dynamic mechanical measurements where local electronics are undesirable.
Pressure-based optical sensing for hydrostatic measurements in liquids and other demanding environments.
Application packages
A sensing modality is only one part of a complete solution. Packaging, optical routing, interrogation, data handling and deployment are configured around the application.

Application-specific sensor integration, optical routing, readout and data handling for transformer development and monitoring programmes.
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Flexible optical measurement systems for prototyping, sensor evaluation and controlled characterization.
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Joint development of sensing points, packaging, optical routing and system architecture for integration into manufactured equipment.
View application ↗Why the platform matters
The sensing point operates without conventional local electronics.
Application-specific packaging and optical routing can minimize or eliminate metal near the measurement location.
Active interrogation and processing can remain outside the asset, simplifying service, upgrades and integration.
A common optical architecture can support multiple sensing modalities and application-specific configurations.
Your measurement case
We can help assess feasibility, define integration constraints and identify the right platform configuration.