Technology

Optical MEMS.
Built for the asset.

CEKO combines microfabricated sensing structures with optical readout. The passive sensing point can be positioned close to the physics of interest while interrogation and system electronics remain outside the asset.

Wafer-level platformOptical readoutSystem scalability
MEMS array on wafer

Principles

Three layers of the platform.

The platform combines MEMS structures, optical signal transport and external interrogation in one scalable measurement architecture.

Wafer-level MEMS

Wafer-level MEMS

The sensing platform starts at wafer level, where optical MEMS structures are fabricated with scalability in mind.

Optical transduction

Optical transduction

Physical change is translated into an optical response that can be transported without bringing conventional electronics into the sensing point.

System integration

System integration

The sensing technology integrates with multiplexing, optical interrogation and data systems to form a complete monitoring platform.

Architecture

From one platform to multiple sensing points.

Multiplexing allows several optical sensing points to be interrogated within one broader system architecture.

  • Passive sensor structures created on a scalable MEMS platform.
  • Optical fiber used for signal transport away from the harshest part of the environment.
  • Interrogation and data handling performed in the external SDAS Insight unit.

Try the optical sensing simulator to the right and explorer how optical sensors can be monitored simultaneously to create powerful monitoring systems. You can click the expand button in the top right corner of the simulator to make it larger.

Interactive demo

Optical sensor multiplexing

Explore the full measurement chain — from broadband light in the fiber to dashboard-ready sensor values.

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The SDAS sends broadband light into the fiber, each connected sensor reflects its own narrow wavelength band, and the SDAS fits the reflected peaks to extract physical values such as temperature, vibration, force, or hydrogen.

Change physical conditions

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These sliders change the physical influence acting on each connected sensor. Temperature, force, and hydrogen retain a visibly slower response than vibration, but have been accelerated here so changes remain easy to observe during a short website visit.

Move the sliders for connected sensors to change the physical influence.

Connect a sensor or use a preset to reveal the controls.

Optical spectrum

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Each connected sensor occupies its own wavelength band. Physical influence shifts the reflected peak position, and the SDAS fits those peak positions before converting them into physical values.
Light response → wavelength fit → physical values
123SDASoptical read-outfitted λ→ physical valuesdashboarddecoded physical valuesTemperature--Vibration--Force--
Process view
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White pulses show broadband interrogation light leaving the SDAS and splitting toward each connected sensor. A brief ring marks the reflection at each sensor before the wavelength-coded return pulse travels back. The instrument display inside the SDAS then glows as the returned peaks are measured, fitted, and converted into the physical values shown on the dashboard and output traces.

Decoded measurements

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These traces represent the sensor-specific values after the SDAS has fitted the optical peaks and mapped them into physical parameters.
Dashboard-ready sensor values
Select a sensor or use a preset to begin.

Representative performance view

Sensitivity vs. bandwidth performance.

The figure compares sensor sensitivity and maximum operating frequency using a figure of merit derived for a harmonic oscillator. Each point represents a specific CEKO sensor or a frequency-modulated optical sensor reported by competitors or in the scientific literature.

Sensitivity versus frequency bandwidth chart

What the comparison shows

CEKO optical MEMS sensors combine high sensitivity with substantially higher usable bandwidth than conventional fully optical and frequency-modulated sensing technologies, including FBG-based sensors.

  • Each marker represents a concrete sensor design.
  • CEKO optical MEMS sensors extend the achievable sensitivity–bandwidth envelope.
  • Performance developed for demanding condition-monitoring applications.
Discuss the technology

Full system

Not only a chip.

CEKO develops the full chain from sensing point and optical interrogation to field deployment and usable operational data.

CEKO sensor head
01

Sensing point

Passive optical MEMS at the measurement location.

SDAS Insight unit
02

Interrogation

SDAS Insight handles readout, control and data handling outside the asset.

Monitoring dashboard
03

Usable output

Operators and partners see trends, dashboards and condition information rather than raw optical signals.