Validation

Measured performance.
Tested in context.

CEKO validates the complete measurement chain, from MEMS structures and packaging to optical interrogation, data handling and application-oriented demonstrations.

Controlled characterizationEnvironmental testingSystem-level validation
CEKO optical MEMS sensor

Application performance

Designed for demanding environments.

Each application presents different measurement and integration requirements. CEKO's optical MEMS platform is designed for environments with high temperatures, strong electromagnetic fields and substantial mechanical loads. Sensor structures, packaging and optical interfaces can be adapted to the requirements of the specific application.

Temperature

Passive optical temperature measurement for electrically and environmentally demanding locations.

Transformer oil, winding environments and application-specific integration concepts.

Vibration

Optical MEMS sensing for dynamic mechanical measurements where local electronics are undesirable.

Structural vibration, machinery monitoring and application-specific acoustic signatures.

Hydrostatic

Pressure-based optical sensing for hydrostatic measurements in liquids and other demanding environments.

Pressure-derived monitoring in e.g. hydrostatic measurements or acoustics.

Representative work

Evaluated at component, system and application level.

CEKO sensors and readout systems are evaluated throughout the development process, from individual structures and packaged devices to integrated measurement systems and field installations.

Sensitivity versus bandwidth comparison chart

Dynamic sensing

Sensitivity and bandwidth

Representative CEKO sensor designs extend the sensitivity-bandwidth envelope compared with conventional fully optical sensing approaches.

CEKO SDAS Insight installed in the field

System deployment

From sensing point to field data

Field installation verifies the practical chain from optical sensing and routing to external readout, connectivity and usable monitoring data.

Close view of optical MEMS structures on a wafer

Technology platform

Developed and evaluated at multiple levels

Wafer-level structures, packaged sensors, readout electronics and system integration are developed as connected layers rather than isolated components.

Validation approach

A monitoring system is only useful when its layers work together.

Validation therefore progresses from sensing structure and packaging to readout, integration and representative application conditions. CEKO develops the key layers of the measurement chain, from the MEMS device and optical readout to data handling and cloud-based dashboards. This allows interfaces and performance to be evaluated as one complete system.

  1. 01

    Structure and packaging

    The sensing element, package and optical interface are evaluated against the intended measurement range and operating environment.

  2. 02

    Controlled characterization

    Sensitivity, repeatability, noise, dynamic response and environmental behaviour are characterized in controlled test setups.

  3. 03

    System validation

    Sensors, optical routing, SDAS readout and data handling are tested together as one measurement chain.

  4. 04

    Application demonstration

    Representative installations and application-oriented tests connect laboratory performance with realistic operating conditions.

Technical information

Discuss your monitoring challenge with us.

Tell us what you need to measure and under which conditions. We can help assess feasibility, identify a suitable sensing approach and define the next validation step for your application.